Reliability of flip-chip bonded RFID die using
anisotropic conductive paste hybrid material

Jun-SikLEE,Jun-KiKIM,Mok-SoonKIM,NamhyunKANG,Jong-HyunLEE

Transactions of Nonferrous Metals Society of China ›› 2011, Vol. 21 ›› Issue (Special 1) : 175-181.

The Nonferrous Metals Society of China
Transactions of Nonferrous Metals Society of China ›› 2011, Vol. 21 ›› Issue (Special 1) : 175-181.
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Reliability of flip-chip bonded RFID die using
anisotropic conductive paste hybrid material

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2011, 21(Special 1): 175-181

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